Samsung is currently ramping a 7nm process which uses EUV for seven layers.

TSMC appears to be second in EUV usage with the intention of starting to ramp a 7nm process which uses EUV for six layers early in 2019.

Intel is not planning to start EUV production until 2020.

Throughput for 96 layers on ASML’s 250W power source stepper is 140wph without a pellicle and 116wph with a pellicle.

RECOMMENDED ARTICLES

MagnaChip launches LDO regulator for SSDs

Molex launches 15x6mm WiFi flexible antenna

NAND price to fall 10% in Q1